Semiconductor Processing Technicians
Tasks
Core Tasks Include:
- Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
- Maintain processing, production, and inspection information and reports.
- Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
- Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
- Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
- Load and unload equipment chambers and transport finished product to storage or to area for further processing.
- Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
- Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Supplemental Tasks Include:
- Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
- Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
- Load semiconductor material into furnace.
- Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
- Count, sort, and weigh processed items.
- Calculate etching time based on thickness of material to be removed from wafers or crystals.
- Inspect equipment for leaks, diagnose malfunctions, and request repairs.
- Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
- Stamp, etch, or scribe identifying information on finished component according to specifications.
- Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
- Scribe or separate wafers into dice.
- Connect reactor to computer, using hand tools and power tools.
- Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
- Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
- Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
- Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
The data sources for the information displayed here include: O*NET™. (Using onet28)